Description:

1. Participate in the design, development, and optimization of FMCW radar algorithms.
2. Responsible for documenting radar signal processing algorithms.
3. Contribute to defining radar system parameters and performance metrics.
4. Handle hardware and software debugging of the system.
 

Qualifications:

1. Master's degree or higher with over 3 years of experience in radar algorithm research.
2. Familiarity with digital signal processing for FMCW radar, including FMCW waveform definition, AoA estimation, CFAR, etc.
3. Proficiency in Matlab, C/C++.
4. Strong communication and teamwork skills.
5. Fluent in English for reading and writing communication.
 

Description:

1. Master and oversee the design implementation process for advanced processes, participating in chip design from RTL to GDSII.
2. Responsible for chip planning and layout, dividing the top-level design into lower-level modules.
3. Power and clock distribution and planning.
4. Layout and routing, including all aspects from top-level design to lower-level modules.
5. Static timing, power, noise, and manufacturability optimization and analysis.
 

Qualifications:

1. Bachelor's degree or higher with over 3 years of experience in chip backend design.
2. Proficient in using PR tool Innovus with experience in the entire backend flow from NETLIST to GDSII.
3. Proficient scripting skills using languages such as Tcl, Perl, Python, etc.
4. Prior experience in high-speed interface design, such as LVDS, MIPI, is a plus.
5. Excellent communication and teamwork skills.
6. Fluent in English for reading and writing.
 

Description:

1. Design the architecture for foundational software related to millimeter-wave radar based on business and product requirements.
2. Develop, integrate, debug, and configure overall low-level software (bootloader, chip drivers, communication, diagnostics, application layer protocols).
3. Collaborate with radar signal processing algorithm engineers to implement algorithm porting and optimization.
4. Ensure the quality and readability of software development documentation and maintain timely updates and improvements to code comments.
5. Handle temporary assignments related to MCU software development or other relevant areas as directed by superiors.

Qualifications:

1. Bachelor's degree or higher in a related field such as computer science or software engineering.
2. Over 5 years of relevant work experience with a strong background in embedded software development for automotive millimeter-wave radar. Experience with MCU or SOC platforms for automotive millimeter-wave radar from companies like TI or NXP is a plus.
3. Proficiency in C/C++ programming and extensive experience in driver software debugging and embedded system development.
4. Familiarity with ARM, DSP, multi-core microprocessor architectures, and a good understanding of low-level interfaces such as SPI, I2C, UART, CAN, LVDS, MIPI, Ethernet, with knowledge of hardware and upper-level interfaces.
5. Strong coding and technical documentation writing practices.
6. Excellent communication skills to effectively collaborate with diverse teams.
7. Good English language proficiency in listening, speaking, reading, and writing.
 

Description:

1. Responsible for the design, production, and RF parameter testing of millimeter-wave antennas.    
2. Handle electromagnetic simulations for RF chip packaging and PCB-level designs.    
3. Establish millimeter-wave radar testing environments and conduct relevant RF testing.    
4. Assist layout engineers in PCB layout design.    
5. Participate in hardware system requirements research, analysis, and the creation of technical documents for product projects.    
6. Optimize and resolve issues exposed during product development, testing, and post-sales support.    

Qualifications:

1. Bachelor's degree or higher in electronics or related fields.    
2. Over 5 years of relevant work experience with a strong background in electromagnetic fields, microwaves, and antenna-related expertise. Some understanding of automotive millimeter-wave radar systems is a plus.    
3. Proficiency in electromagnetic simulation software such as HFSS, CST, ADS, etc.    
4. Proficient in antenna and millimeter-wave radar testing methods.    
5. Familiar with RF chip packaging and PCB-level electromagnetic simulation methods.    
6. Excellent communication skills to effectively collaborate with diverse teams.    
7. Good English language proficiency in listening, speaking, reading, and writing.    
 

Description:

1.Engage in all phases of chip development from design to production, including circuit design, layout, simulation verification, sample testing, production debugging, etcs. Ensuring on-time chip delivery and drafting relevant documentation.
2.Communicate effectively with supervisor and be able to understand and complete tasks assigned by department supervisor as required.

Qualifications:

1. Master's degree or above in Electronics, Microelectronics, or related subjects.
2. Over 3 years of experience in analog circuit design or related roles.
3. Solid foundational knowledge, profound understanding of basic concepts in analog and mixed-signal design, such as mismatch, linearity, stability, noise, etc.
4. Proficient in theoretical understanding and design of common analog modules, such as Bandgap, LDO, POR, OP, OSC, etc.
5. Proficient in one or more of the following EDA tools: conventional simulation tools like Spectre, Hspice, fast simulation tools like XA, FineSim, parasitic extraction tools like PEX, QRC, EMX.
6. Prior experience in designing one or more of the following modules is preferred: ADC, DAC, PLL, DLL.
7. Preferred experience in end-to-end design of large-scale, high-performance mixed-signal chips.
8. Practical design experience in advanced process nodes of 65nm and below, with successful production experience, is preferred.
9. Excellent experience in designing at least one or more of the following circuit types: low-power circuits, low-noise circuits, high-precision circuits, high-speed circuits.
10. Strong English reading and writing skills; excellent spoken English communication skills are particularly advantageous.

Description:

1. Responsible for detailed transistor-level RF/millimeter-wave layout design and simulation module layout design, including LNA, mixers, PLL, LO generation, power amplifiers, ADC/DAC, baseband filters, and bandgap/bias/LDO.
2. Perform module-level layout design and top-level layout design, along with layout parameter extraction, DRC, LVS, and DFM checks.
3. Collaborate with design engineers on module-level and top-level layout floorplan design.
4. Conduct layout reviews, including power and ground routing, electromigration, signal path checks, differential and IQ signal matching, and signal coupling.
5. Integrate and verify top-level module and ensure alignment with project schedules.
6. Handle temporary assignments related to layout or relevant areas as directed by superiors.

Qualifications:

1. Bachelor's degree or higher in Microelectronics, Integrated Circuits, or a related field with over 5 years of relevant work experience.
2. Experience in layout design of RF and analog circuit modules, including ADC/DAC, PLL, radio transceivers, resistors, capacitors, pad IOs, ESD protection, etc. Profound knowledge of sub-micron CMOS processes.
3. Proficiency in layout design, including device matching, parasitic reduction, RF shielding, and high-frequency signal routing.
4. Solid understanding of RC delay, IR drop, electromigration, and coupling.
5. Familiarity with guard rings, DNW, PN junctions, and process non-ideal effects such as LOD and WPE.
6. Proficient in using Calibre DRC, ERC, LVS tools.
7. Proficient in using Cadence layout tools.
8. Excellent communication skills to effectively collaborate with diverse teams.
9. Good English language proficiency in listening, speaking, reading, and writing.
 

Description:

1. Formulate verification strategies and design verification environments.
2. Develop reusable verification environments.
3. Create verification plans and assess verification workloads.
4. Perform front-end simulation, back-end simulation, low-power simulation, and more.
5. Analyze simulation errors and collaborate with design personnel to pinpoint and resolve issues.
6. Report coverage results and analyze coverage and uncovered items.
7. Assist in various activities throughout the entire project lifecycle, including design development, chip testing, prototype validation, FPGA development, and more.

Qualifications:

1. Bachelor's or Master's degree in a relevant field of microelectronics.
2. Over 3 years of experience in digital design verification projects.
3. Proficiency in multiple programming languages (any one or a combination of SystemVerilog, C, Python, Makefile, Tcl Scripting, etc.).
4. Consideration will be given to candidates with extensive UVM experience.
5. Experience with assertion-based verification is a plus.
6. Preferred candidates will have experience in SoC, MIPI, or FuSa verification.
7. Self-driven with a strong ability to learn and problem-solve independently.
8. Proficient in English communication, including both spoken and written language.
 

Description:

1. Responsible for participating in the development of packaging solutions for high-performance millimeter-wave radar through simulation models, including RF chips, microcontrollers, and antenna packaging.
2. Define, develop, and optimize electronic packaging solutions for products using electromagnetic simulation models. Provide guidance on design principles, material selection, local optimization, and risk identification.
3. Communicate and collaborate closely with chip layout design engineers to ensure successful design verification and seamless integration of chips.
4. Prepare S-parameter test experiments, participate in relevant testing, and understand the differences between actual production and simulation model assumptions, as well as trends indicated by the models.
5. Maintain design rules, create and update process specification documents, and provide application guidelines for internal use and customer communication.
6. Possess professional knowledge of electronic packaging guidelines, assembly processes, and potential risks to support process optimization, supplier/material selection, design reviews, and technical assessments.
7. Establish basic prototypes of simulation models, guide reports, create material libraries, and maintain foundational information for model assumptions. Achieve continuous and unified model iteration and optimization.

Qualifications:

1. Bachelor's degree or higher in Electrical Engineering or a related field, with over 3 years of semiconductor packaging design and execution experience. Candidates with 5 or more years of experience in electromagnetic simulation software and a Master's or Ph.D. degree in Electrical Engineering will be preferred.
2. Proficiency in electromagnetic simulation software for SI/PI tools (e.g., XtractIM, PowerSI, HFSS, Q3D, etc.), extensive experience with packaging models, and knowledge of S-parameters and RLGC models.
3. Comprehensive knowledge of RF and millimeter-wave passive component design with a focus on transceivers and radar systems.
4. Understanding of S-parameters for structures and models, as well as the impact of dielectric constants and dissipation factors of various materials on packaging performance and potential failure risks.
5. Strong problem-solving skills, a solid understanding of physics, and knowledge of material characterization and analysis.
6. Familiarity with IC packaging design and computer-aided design software.
7. Excellent communication skills in both Chinese and English, capable of collaborating effectively with cross-functional teams, external test labs, and domestic suppliers.
8. Ability to work independently and handle projects with minimal supervision.

Exceptional candidates may be considered for Shanghai or Beijing.
 

Description:

1. Develop DSP solutions based on radar system requirements. Understand the technical requirements and in-depth technical aspects of the product line, and participate in defining the technical parameters and performance metrics the product should have.
2. Convert radar algorithms and implement them on DSP, ensuring compliance with technical parameters and performance metrics. Participate in or lead the determination of software design solutions and undergo technical reviews.
3. Collaborate closely with radar system, algorithm, and firmware engineers to complete MCU firmware development and software system architecture. Engage in software programming, debugging, and testing tasks, among others.
4. Provide complete and accurate software development design documentation as per development requirements.

Qualifications:

1. Over 5 years of experience in DSP core and hardware accelerator unit design for automotive millimeter-wave radar SoC and MCU.
2. Familiar with the architecture of common MCUs/SOCs and have experience in developing drivers for interfaces like SPI, EDMA, LVDS, CSI, etc.
3. Proficient in the basic principles of RTOS and possess experience in RTOS development and porting.
4. Strong C language programming skills and a good understanding of DSP architecture and principles.
5. Able to read hardware schematics and chip datasheets, with the ability to perform software-hardware integration debugging.
6. Experience with mainstream MCU chips from brands like TI, NXP, etc., is a plus.
7. Proficient in English reading and writing.

Description:

1. Responsible for designing and developing packaging solutions for high-performance chips to ensure product reliability, performance, and manufacturability. 
2. Collaborate closely with the design team, test engineers, and manufacturing team to participate in the packaging development process from concept to production.
3. Electrical Simulation
--Use electromagnetic field simulation tools (e.g., HFSS) to model and simulate RF signals in packaging, extracting key parameters such as insertion loss and return loss.
--Analyze and resolve electromagnetic compatibility (EMC) and signal integrity (SI) issues in packaging design (e.g., MIPI, LVDS) to ensure reliable and stable signal transmission.
4. Packaging Design
--Design and optimize chip packaging solutions, including packaging types, pin layouts, dimensions, packaging materials, etc., to meet product performance and reliability requirements.
--Conduct packaging design validation and simulation, using packaging design software (such as Cadence Allegro) for packaging layout and pin assignment.
--Integrate die PAD design (including PAD layout), substrate design (including ball map), PCB layout, and other requirements to create a comprehensive design solution.
5. Thermal Simulation
--Possess a foundational understanding of packaging thermal management concepts and collaborate with the thermal simulation team to address heat dissipation issues in packaging.
--Optimize packaging manufacturing processes and substrate design based on thermal simulation results.
6. Packaging Process and Reliability
--Collaborate with OSAT for WLCSP and FCBGA packaging to ensure the reliability and manufacturability of packaging designs.
--Familiar with packaging reliability testing standards and able to develop corresponding reliability test methods.

Qualifications:

1. Bachelor's degree or higher in fields such as electronic engineering, electrical engineering, or microelectronics engineering. A minimum of 5 years of relevant work experience, with a preference for those with experience in millimeter-wave radar chip development.
2. Proficient in using electromagnetic field simulation tools (e.g., HFSS) and packaging modeling and simulation.
3. Proficient in using packaging design software, such as Cadence Allegro, with the ability to perform packaging layout and pin assignment.
4. Possess a basic understanding of packaging thermal management concepts.
5. Familiar with the basic processes and production flow of WLCSP and FCBGA packaging.
6. Have some experience in packaging reliability.
7. Proficient in English language skills, including listening, speaking, reading, and writing.

Responsibilities:
Responsible for the module design of RF/millimeter wave chips;
Participate in all links from chip design to mass production, such as circuit design, layout, simulation verification, sample testing, mass production debugging, etc., to achieve chip delivery on schedule, and write relevant documents.

Qualifications:
Master's degree or above in electronics, microelectronics, radio frequency, microwave or related disciplines;
More than 8 years of RF chip circuit design or related work experience, rich experience in RF chip development, and participated in the whole process of the chip from product definition to mass production;
Solid basic knowledge, deep understanding of the basic concepts and theories of analog and RF design, such as mismatch, linearity, stability, noise, etc.;
At least one or more of the following RF module design experience and successful mass production, such as RF front-end, PA, LNA, Mixer, OSC, PLL, LO, VGA, Filter, TIA, or other deep sub-micron process baseband module; Experience with high-speed digital circuits (such as counters, frequency dividers, etc.);
Familiar with CMOS process technology, practical design experience in advanced process nodes of 65nm and below, and successful mass production is preferred;
Experienced in RF chip testing, proficient in using spectrum analyzers, oscilloscopes, signal generators, and able to perform statistical analysis on a large number of chip data;
Ability to build behavioral models using VerilogA/AMS;
Strong English reading and writing skills, especially strong oral English skills.

Company Recruitment Email：qiqi.li@mywmicro.com
Tel.+49 (0) 89 20802 6509

Responsibilities:
System analysis and verification of RF/millimeter wave chip products;
Decompose product RF performance indicators into chip indicators and module (LNA/PA, etc.) indicators;
Understand RF system architecture, analyze potential noise sources and interference mechanisms;
Locate RF performance problems and propose improvement solutions;
Review schematic design and plate design;
Propose test equipment requirements and improve test methods to more effectively characterize product characteristics;

Qualifications:
Undergraduate degree or above in electronics, microwave or related disciplines;
More than 8 years working experience in RF system, working experience in millimeter wave system is preferred;
Solid basic knowledge, a deep understanding of the basic concepts of RF microwave, and the meaning and connotation of RF system performance parameters;
Have a deep understanding of various RF/millimeter wave systems, such as: 77-79GHz radar, mobile terminals, WIFI, etc.;
Familiar with the principle of RF system and have actual measurement experience;
Master the locating method of RF system problems and understand the noise source and interference source of RF system;
Familiar with general RF test instruments and understand their principles.
Strong English reading and writing skills, especially strong oral English skills.
Location: Shenzhen, Shanghai, Europe

Company Recruitment Email：qiqi.li@mywmicro.com
Tel.+49 (0) 89 20802 6509

Responsibilities:

1. Responsible for high-speed, low-power ADC and DAC design in mixed-signal chips.
2. Support system engineers in analyzing system specifications and defining performance parameters for ADC and DAC IPs.
3. Participate in all phases of chip development from design to mass production, including circuit design, pre-simulation, layout design, post-simulation, sample testing, production trouble shooting, etc. Deliver chip products on schedule, and drafting relevant documentation.
4. Communicate and collaborate closely with analog design team and other cross-functional teams, achieve the project goal timely with high quality.
5. Effectively communicate with supervisors, understand and complete tasks assigned by the department supervisor.

Qualifications:

1. Master's degree or above in Electronics, Microelectronics, or related subjects, 2-3 years of experience or above in analog circuit design or related roles.
2. Solid fundamental knowledge, deep insight of basic concepts in analog and mixed-signal design, such as mismatch, linearity, stability, noise, etc. Good understanding of theoretical analysis and design of common analog  blocks, such as bandgap reference, operational amplifiers, sample-hold circuits, high-speed comparators, etc.
3. Designed at least one type of ADCs , such as Sigma-delta ADC (DT or CT), SAR ADC (synchronous or asynchronous), and DACs including but not limited to Current Steer DAC, R2R DAC, etc.
4. Good experience at using Matlab or other tools for modeling, skilled in using one or more of the following EDA tools: conventional simulation tools like Cadence, Hspice  etc.; fast simulation tools like APS, XPS, XA, FineSim etc.; capable of performing AMS simulations, capable of using parasitic extraction tools like PEX, QRC, EMX etc.
5. Practical design experience in advanced process nodes of 40nm or  below, candidates had full process design experience of large-scale, high-performance mixed-signal chips will be preferred, candidates had successful production experience will be a plus.
6. Team player with proactive attitude, capable of working collaboratively with team members to drive project progress.
7. Strong English reading and writing skills; excellent spoken English communication skills are particularly advantageous.